Susie Armstrong
Senior Vice President, Engineering
Qualcomm, Inc.
Susan M. Armstrong started at Qualcomm working on Globalstar and then early CDMA base station projects. She was a pioneer in bringing internet protocols to the cellular industry, resulting in the first web surfing on a cellular phone in 1997, and Qualcomm’s commercialization of packet data in 1998. Since then she has held various leadership positions, first responsible for the development and commercialization of the all of the software that drives Qualcomm’s chipsets, and then as the head of worldwide Customer Engineering. In addition to her work on Qualcomm’s inventions and new technologies, she has worked extensively with base station makers, carriers, phone and device makers in the US, Asia and Europe to bring those technologies to market. In 2015, Armstrong joined Qualcomm’s Government Affairs group, where she brings an engineering and product background the Government Affairs work in worldwide public policy, including intellectual property protection, cyber security, STEM and STEM diversity.
Dr. James Chen
Associate Vice President, Product Marketing
MediaTek USA, Inc.
Dr. James C. Chen leads Operator Product Marketing for the Americas and Europe. In this capacity, he spearheads the marketing and strategic positioning of MediaTek’s products for Operators with focus on 5G for Beyond Smart Phone applications and Wi-Fi connectivity. His role also encompasses strategic relationships with major customers, product roadmap, and representing MediaTek in key standards organizations. James studied at the University of California at Berkeley where he received Bachelors, Masters, and Ph.D degrees in the area of Electrical Engineering and Computer Sciences. He has published over 30 technical papers and has been granted over 10 patents.
Mike Hogan
SVP and GM of Automotive, Industrial, and Multi-Market
GlobalFoundries
Michael Hogan is Senior Vice President and General Manager of Automotive, Industrial and Multi-Market business unit since September 2019. He has more than 35 years of experience in the semiconductor industry. Prior to joining GF in 2019, Mr. Hogan was Senior Vice President and General Manager of IoT (Internet of Things) Compute and Wireless at Cypress Semiconductor from 2016 to 2019. From 2011 to 2016, he held a variety of business line management and strategy roles at Broadcom/Avago across an array of wireless technologies, from Wi-Fi to cellular, prior to co-founding the IoT business that was subsequently divested to Cypress Semiconductor in 2016. Prior to that, he was CEO of PulseCore Semiconductor and Sirific Wireless from 2002 to 2008. Mr. Hogan was the founding General Manager of the WLAN (wireless local area network) business at Texas Instruments, where he held a variety of sales and business unit general manager roles during his 16-year tenure. Mr. Hogan holds a bachelor’s degree from Syracuse University.
Dr. Paul Rousseau
Senior Director, Field Technical Solutions Division
TSMC North America
Dr. Paul Rousseau is a Senior Director heading TSMC’s Field Technical Solutions Division. In his current capacity, his team supports all technology engagements for North America customers. He has held a variety of positions at TSMC ranging from managing the smallest to the biggest customers. He joined TSMC in 1999 from Hewlett-Packard Labs. Paul earned his Ph.D and his Masters of Science Degree from Stanford University in Applied Physics.
Jimmy Goodrich
Vice President, Global Policy
Semiconductor Industry Association
Jimmy Goodrich joined SIA in 2015 and is vice president for global policy. In this role, Jimmy leads SIA’s global policy team and works to advance SIA’s international competitiveness, trade, supply chain, and China policy agenda. An expert in Chinese technology and innovation, Jimmy is a member of the Executive Committee for Beijing-based United States Information Technology Office (USITO), representing SIA in his capacity. Jimmy has a bachelor’s degree in comparative politics and East Asian studies from Ohio University. He is fluent in Mandarin.
