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Executive Summary Acknowledgments Assembly and Packaging Design Emerging Research Devices Emerging Research Materials Environment, Safety, and Health Factory Integration Front End Processes Interconnect Lithography Metrology Micro-Electro-Mechanical Systems (MEMS) Modeling and…

…front-end fabrication stage is complete, the finished semiconductor wafers are then transported to another manufacturing facility where the third and final stage occurs. This stage, commonly known as back-end assembly,…

…Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) Radio Frequency and Analog/Mixed-Signal Technologies (RFAMS) for Wireless Communications System Drivers Test and Test Equipment Yield Enhancement…

…Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) Radio Frequency and Analog/Mixed-Signal Technologies (RFAMS) for Wireless Communications System Drivers Test and Test Equipment Yield Enhancement…

…Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) Radio Frequency and Analog/Mixed-Signal Technologies (RFAMS) for Wireless Communications System Drivers Test and Test Equipment Yield Enhancement…

…Design Environment, Safety, and Health Factory Integration Front End Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) System Drivers Test and Test Equipment Yield Enhancement…

…economy, bolster America’s global technology leadership, and help ensure the United States writes the rules for 21st Century trade. Free trade is critical to U.S. jobs and economic growth because…

…free trade agreements because it provides the necessary assurance that an agreed-to deal will receive a simple up-or-down vote from Congress, which in turn means swifter and more productive negotiations…

WASHINGTON—April 16, 2015—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today applauded bipartisan Trade Promotion Authority (TPA) legislation introduced by Senate Finance Committee Chairman Orrin…

…providing for duty-free treatment of certain information and communications technology (ICT) products, including semiconductors. “We are deeply disappointed in this outcome and believe it was a missed opportunity. A deal…

…complex issues is a challenging effort but critical for our collective national interests. SIA applauds the efforts of the U.S. and EU governments and stands ready to support. [1] https://www.bcg.com/en-us/publications/2020/restricting-trade-with-china-could-end-united-states-semiconductor-leadership…