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Press Release: 01/15/20

Semiconductor Industry Applauds U.S.-China Trade Deal

WASHINGTON—Jan. 15, 2020—The Semiconductor Industry Association (SIA) released the following statement from president & CEO John Neuffer regarding the “phase one” U.S.-China trade agreement signed today. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor company sales. “The ‘phase one’ trade agreement signed today […]

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Press Release: 12/13/19

SIA Welcomes ‘Phase One’ U.S.-China Trade Deal

WASHINGTON—Dec. 13, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, released the following statement from SIA president & CEO John Neuffer regarding the “phase one” U.S.-China trade deal announced today. “We welcome the ‘phase one’ trade agreement reached today, which provides needed relief for the semiconductor industry by reducing […]

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Press Release: 11/20/19

SIA Statement on Licenses for Exports to Huawei

WASHINGTON—Nov. 20, 2019—The Semiconductor Industry Association (SIA) today released the following statement from president & CEO John Neuffer regarding the approval of licenses for exports to Huawei. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor sales. “We welcome the Administration’s approval of export licenses […]

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Press Release: 10/11/19

SIA Statement on ‘Phase One’ U.S.-China Trade Agreement

WASHINGTON—Oct. 11, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, released the following statement from SIA president & CEO John Neuffer regarding the “phase one” U.S.-China trade agreement announced today. “The ‘phase one’ agreement announced today is welcome news for the semiconductor industry, and we look forward to seeing […]

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Press Release: 08/19/19

SIA Statement Following Commerce’s Announcement to Extend the Temporary General License

WASHINGTON—August 19, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from SIA President & CEO John Neuffer following the Department of Commerce announcement adding Huawei affiliates to the entities list and providing an extension of the Temporary General License until November 2019. “While we […]

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Press Release: 06/29/19

SIA Statement Following Trump-Xi Meeting in Osaka

WASHINGTON—June 29, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from SIA president & CEO John Neuffer following the meeting between President Trump and President Xi in Osaka, Japan. “The progress made today by President Trump and President Xi in Osaka is good news […]

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Press Release: 06/21/19

SIA Statement on the Scope of the Addition of Huawei to the Commerce Department’s Entity List

WASHINGTON—June 21, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following updated statement from President & CEO John Neuffer regarding the scope of the Commerce Department’s addition of Huawei Technologies Co. Ltd. (and affiliates) to the Entity List. “SIA companies are committed to rigorous compliance with […]

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Press Release: 05/31/19

SIA Statement on Mounting U.S.-China Trade and Technology Tensions

WASHINGTON—May 31, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from President & CEO John Neuffer in response to mounting U.S.-China trade and technology tensions. “Each volley in the U.S.-China trade dispute causes semiconductor companies to wince and financial markets to wobble, while pushing […]

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Press Release: 05/24/19

Semiconductor Leaders Strike Agreement on Global Policy Agenda

World Semiconductor Council to present proposals to governments in October WASHINGTON—May 24, 2019—The Semiconductor Industry Association (SIA) today welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council (WSC) this week in Xiamen, China. The agreement sets forth policy proposals to strengthen the industry through […]

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Press Release: 05/22/19

SIA Statement on Scope of Temporary General License for Huawei

WASHINGTON—May 22, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement regarding the scope of the Commerce Department’s temporary general license for Huawei Technologies Co. Ltd. “There seems to be confusion about what the temporary general license for Huawei does, with some media reports overstating its […]

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Press Release: 05/20/19

SIA Statement on Commerce Department’s Temporary General License for Huawei

WASHINGTON—May 20, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from President & CEO John Neuffer in response to the Commerce Department’s announcement regarding a temporary general license for Huawei Technologies Co. Ltd. “We hope to work with the Administration to broaden the scope of […]

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Press Release: 05/16/19

SIA Statement on Escalation of U.S.-China Trade and Technology Tensions

WASHINGTON—May 16, 2019—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from President & CEO John Neuffer regarding the recent escalation of U.S.-China trade and technology tensions. “We are troubled by the recent setback in U.S.-China negotiations and the escalation of tensions on both sides, […]

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