Latest News

Global Semiconductor Sales Fell by 2.8 Percent in 2008 Published Monday, February 2, 2009 Semiconductor Sales Slow in November Published Friday, January 2, 2009 October Semiconductor Sales Decline 2.4 Percent Year-on-Year Published Monday, December 1, 2008 September Semiconductor Sales Up 1.6 Percent Year-on Year Published Thursday, October 30, 2008 August Semiconductor Sales Up 5.5 Percent […]

Executive Summary Assembly and Packaging Design Emerging Research Devices Emerging Research Materials Environment, Safety, and Health Factory Integration Front End Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) Radio Frequency and Analog/Mixed-Signal Technologies (RFAMS) for Wireless Communications System Drivers Test and Test Equipment Yield Enhancement

Global Chip Sales Hit $255.6 Billion in 2007 Published Friday, February 1, 2008 November Chip Sales Up 2.3 Percent Year-on-Year Published Sunday, December 30, 2007 October Chip Sales Rose 5 Percent Year-on-Year Published Monday, December 3, 2007 Worldwide Chip Sales Grew by 2.1 Percent in First Half of 2007 Published Friday, August 3, 2007 Worldwide […]

Global Chip Sales Hit Record $247.7 Billion in 2006 Published Friday, February 2, 2007 November Chip Sales Up 11.3 Percent Published Tuesday, January 2, 2007 Semiconductor Sales at Record Levels for Fourth Consecutive Month Published Friday, December 1, 2006 September Chip Sales Remained Strong at $21.4 Billion Published Thursday, November 2, 2006 Worldwide Semiconductor Sales […]

Executive Summary Assembly and Packaging Design Emerging Research Devices Environment, Safety, and Health Factory Integration Front End Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) Radio Frequency and Analog/Mixed-Signal Technologies (RFAMS) for Wireless Communications System Drivers Test and Test Equipment Yield Enhancement

Executive Summary Overall Roadmap Technology Characteristics Assembly and Packaging Design Emerging Research Devices Environment, Safety, and Health Factory Integration Front End Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) Radio Frequency and Analog/Mixed-Signal Technologies (RFAMS) for Wireless Communications System Drivers Test and Test Equipment Yield Enhancement

Executive Summary Assembly and Packaging Design Environment, Safety, and Health Factory Integration Front End Processes Interconnect Lithography Metrology Modeling and Simulation Process Integration, Devices, and Structures (PIDS) System Drivers Test and Test Equipment Yield Enhancement