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WASHINGTON—March 7, 2025— The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding the announcement this week by C.C. Wei of TSMC and President Trump. The company plans to increase its U.S. investment in advanced semiconductor manufacturing by $100 billion – to a new total of $165 billion […]

WASHINGTON—Jan. 21, 2025—Following this week’s inauguration of President Trump and Vice President Vance, the Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer welcoming the new administration. “We congratulate President Trump and Vice President Vance on being sworn in to lead America during this pivotal time for our […]

WASHINGTON—Jan. 17, 2025—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending a series of CHIPS and Science Act agreements announced by the U.S. Department of Commerce, which will support: Construction of a new fab in California and a new advanced packaging and test facility in Pennsylvania […]

WASHINGTON—Jan. 16, 2025—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending CHIPS and Science Act incentives announced by the U.S. Department of Commerce and SIA members Analog Devices, Inc. (ADI) and Coherent. The incentives will support the expansion and modernization of ADI’s advanced R&D facility and […]

WASHINGTON—Jan. 14, 2025—The Semiconductor Industry Association (SIA) today released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress. The policy agenda, titled “Winning the Chip Race,” provides government leaders with actionable policy goals to position the U.S. semiconductor industry for […]

WASHINGTON—Jan. 7, 2025—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC). The CHIPS incentives finalized today will support the construction of a new manufacturing facility on HSC’s […]

WASHINGTON—Nov. 15, 2024—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona. […]

WASHINGTON—Nov. 8, 2024— The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce for Corning and Powerex. The incentives, which are part of the CHIPS and Science Act, will supplement company investments in the U.S. that will create […]

WASHINGTON—Nov. 1, 2024— The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities. The first facility will focus on extreme ultraviolet (EUV) lithography research and will be located within NY CREATES’s Albany […]

by Molly O’Leary, Director of Government Affairs

On Tuesday, the U.S. Department of Treasury and the Internal Revenue Service (IRS) issued the much-anticipated final regulations for the Advanced Manufacturing Investment Credit (AMIC), the 25% investment tax credit enacted by the CHIPS and Science Act (CHIPS Act). The credit, codified in Section 48D of the tax code, is a core component of the […]

WASHINGTON—Oct. 21, 2024—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC). Today’s announced incentives are designed to help HSC build a new hyper-pure semiconductor-grade polysilicon facility in Michigan. “Polysilicon is a critical […]

WASHINGTON—Oct. 18, 2024—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Infinera. The incentives, which are part of the CHIPS and Science Act, will support the development of an advanced test and packaging facility in […]